Copper-based Metal Matrix Composites Reinforced with Diamond, Graphite or SiC for the Thermal Management of Electronic Devices
Abstract as PDF

Fraunhofer Institute for Manufacturing and Advanced Materials (IFAM): Thomas Weissgärber, Thomas Schubert, H. Weidmüller, B. Kieback

Diamond based Composites for Electronics’ Cooling Manufactured in a Cost Efficient Way by Rapid Hot Pressing
Abstract as PDF

Austrian Research Center Seibersdorf (ARCS): Erich Neubauer, G. Kladler, P. Angerer

Aluminium-Diamond: Promising Composites for Thermal Management in Power Electronics
Abstract as PDF

Swiss Federal Laboratories for Materials Research and Testing (EMPA): Sebastien Vaucher, S. Kleiner, O.Beffort, M. Battabyal, K. Ishizak

Copper Matrix Composites Reinforced with High Volume Fraction of Vapour Grown Carbon Nanofibers (VGCNFs) for Heat Management Applications
Abstract as PDF

INASMET Tecnalia: Ramon Martínez, J. Barcena, J.Maudes, P.Egizabal, J.Coleto, M.García de Cortázar

Supply and Availability of Novel High Thermal Conductivity Materials
Abstract as PDF

Plansee SE: Janet Landgraf, Ravi Bollina, Sven Knippscheer, Heiko Wildner

Evaluating the Thermal Behaviour of Novel Heat Sink Materials by CFD Simulation in Potential Applications

Flomerics Inc.: Dirk Niemeier

Material Requirements for Baseplates in Power Electronics
Abstract as PDF

Siemens AG: Svetlana Levchuk, Gerhard Mitic

Lifetime Modelling and Solder Fatigue in Power Electronic Modules
Abstract as PDF

Siemens AG: Monika Poebl, Gerhard Mitic